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| Part: BB28QFN20-D6-SMT-S |
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| Description: Breadboard for analog devices in 28-MLF, 28QFN, package has 600-mil DIP plug for plugging into a DDP socket or solderless breadboard and rows of holes for discrete components and test pins. |
| [Photos|Selection-guides] |
| Part: BBA-56TS1-36-1 |
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| Description: TSOP Type 1 breadboarding, prototyping, adapter has pads on 0.5mm pitch for TSOP Type 1 packages with up to 56 leads. This breadboarding, prototyping, adapter accepts TSOP Type 1 packages with 8.0mm, 14.0mm and 20.0mm tip-to-tip dimensions. Each is connected to 36-mil hole for wire-wrap pins. The board size is 1.2 x 1.5 inches. |
| [Photos|Selection-guides] |
| Part: BBA-QFN-QFP-36-Atmel-1 |
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| Products: |
Breadboards |
| Size: |
1.3x1.3-inches |
| Hole-sizes: |
36-mils |
| Microcontroller: |
Atmel |
| Price: |
$9.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
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| Description: QFN-QFP-TQFP breadboarding, prototyping, adapter for QFN-QFP-TQFP microcontrollers made by Atmel. One side of the adapter has pads on 0.5mm pitch for 32-40-48-56-64-72-80 QFN-QFP-TQFP AVR and 80C51 architecture microcontrollers, while the other side has 0.8mm spaced pads for 0.8mm spaced pads for 32-QFP, 44-QFP, 44-TQFP, and 64-TQFP microcontrollers. The pads are surrounded by two rows of 36-mil holes for wire-wrap pins, components or for soldering of wires. |
| [Photos|Selection-guides] |
| Part: BBA-QFN-QFP-36-Microchip-1 |
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| Description: QFN-QFP-TQFP breadboarding, prototyping, adapter for all QFN-QFP-TQFP PIC microcontrollers made by Microchip Technology. One side of the adapter has pads on 0.5mm pitch for 32-40-48-56-64-72-80 QFN-QFP-TQFP PIC microcontrollers, while the other side has 0.65mm spaced pads for 28-QFN and 44-QFN PIC microcontrollers, 0.8mm spaced pads for 44-QFP and 44-TQFP PIC microcontrollers, and 0.5mm pitch pads for 100-TQFP PIC microcontrollers. The pads are surrounded by two rows of 36-mil holes for wire-wrap pins, components or for soldering of wires. |
| [Photos|Selection-guides] |
| Part: MBB-SOIC-SSOP-36-1 |
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| Description: SOIC-SSOP mini breadboard has pads on 20 mils for SOIC components on one side and pads on 0.65mm pitch for SSOP components on the other side. In addition to a hole associated with every SOIC or SSOP pad, the mini breadboard has five rows of holes on either side of the SOIC and SSOP pads. Those holes accept 300-mil wide DIP packages, wire-wrap pins or components. Hole size is 36 mils for wire-wrap pins. The board size is 2.3 x 2.3 inches. |
| [Photos|Selection-guides] |
| Part: MCBB4X5-20-36-1 |
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| Description: Microcontroller breadboard has pads for most of the SMT packages required for breadbording of a modern microcontroller system. There are pads for QFN, QFP, TQFP, SOIC, SSOP, SOT23 and SC70 packages and holes for one D9 connector which is normally used for RS232C interface. QFN, QFP, TQFP pads on 0.5mm pitch accept QFN, QFP, TQFP packages with 12, 16, 20, 24, 28, 32, 36, 40, 44, 48, 52, 56, 60, 64, 68, 72, 76, 80 and 84 leads or contacts. SOIC pads, on 50-mils pitch, accept SOIC packages of any width up to 56 leads or a combination of several smaller SOIC packages. SSOP pads, on 0.65mm pitch, accept 36-lead SSOP packages with any body width or a combination of smaller SSOP packages. Also available are pads for two SOT23-6 and two SC70 packages. Every hole has next to it power and ground lines. Hole size is 36 mils for wire-wrap pins. The board size is 4 x 5 inches. |
| [Photos|Selection-guides] |
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